High Temperature Low Force Test System – BI-7200
The High Temperature Low Force Test System – BI-7200 is a specialized, compact, servo-hydraulic testing machine designed for conducting low-force mechanical tests under elevated temperature conditions. Ideal for material characterization, thermal fatigue analysis, and research in microstructural behavior, this advanced test system supports precise static and dynamic loading of specimens at temperatures up to 1200°C.
Engineered for accuracy, repeatability, and high thermal stability, the BI-7200 integrates a miniature high-temperature furnace, servo-controlled actuators, and high-resolution sensors. It is well-suited for testing metals, ceramics, composites, and additive-manufactured materials. The system’s DSP-based digital controller, air-cooled hydraulic unit, and compact footprint make it a reliable solution for R&D labs, universities, and advanced manufacturing environments.
Specifications of High Temperature Low Force Test System (BI-7200)
| Feature | Details |
|---|---|
| Actuator Capacity | ±5 kN dynamic force range |
| Maximum Temperature | Up to 1200°C using resistive furnace |
| Displacement Resolution | Better than 0.1 µm |
| Control System | 32-bit DSP-based digital servo controller |
| Hydraulic Power Unit | Low-noise, air-cooled, energy-efficient |
| Frame Design | High-stiffness, compact single-column frame |
| Furnace Type | Miniature vertical resistance furnace with ceramic insulation |
| Safety Features | Thermal shielding, emergency stop, over-temp interlocks |
| Cooling System | Air-cooled system – no water required |
| Power Supply | 230V / 50 Hz or 110V / 60 Hz options |
| Compliance Standards | ASTM E21, ASTM E606, ISO 6892-2 |
Key Features of the High Temperature Low Force Test System
- High-Temperature Capability up to 1200°C: Equipped with a miniature vertical resistance furnace and temperature controllers, enabling thermal fatigue, creep, and stress relaxation studies at elevated temperatures.
- Low Force Actuation with Precision Control: Supports servo-hydraulic dynamic actuation up to ±5 kN, with ultra-fine resolution ideal for testing small or delicate specimens like micro-alloys and thin films.
- Compact, High-Stiffness Load Frame: Engineered with low thermal drift and high stiffness, the frame ensures repeatable, stable performance during long-duration, high-temperature tests.
- High-Resolution Displacement Measurement: Integrated with LVDTs or digital encoders, offering sub-micron resolution and real-time displacement feedback, crucial for micro-mechanical deformation studies.
- Modular Furnace and Grip Configuration: Features a slide-out furnace design for easy access, along with ceramic thermal shields and custom grips to support different specimen geometries and materials.
- Digital Servo Control System: Uses a 32-bit DSP-based controller for precise waveform generation and control, supporting ramp, triangle, sine, and user-defined loading profiles.
- Thermal Isolation and Safety Design: Designed with heat shields, cooling jackets, and safety interlocks to protect sensitive electronics and maintain operator safety during high-temperature operations.
- Hydraulic Power Unit (HPU) with Air Cooling: Integrated low-noise air-cooled HPU, eliminating the need for water cooling, reducing system complexity, and improving mobility and energy efficiency.
- Standards Compliance: Fully supports test methods in accordance with ASTM E21, ASTM E606, and ISO 6892-2, making it suitable for international quality and reliability programs.
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Applications of the BI-7200 High Temperature Test System
1. High-Temperature Material Characterization: Used to study tensile, compressive, and flexural behavior of materials at elevated temperatures including superalloys, ceramics, and heat-resistant polymers.
2. Low Cycle Fatigue (LCF) Testing: Essential for evaluating strain-controlled fatigue behavior of metals and welds subjected to thermal and mechanical loading in power generation, aerospace, and automotive industries.
3. Thermal Fatigue Testing of Additive Manufacturing Materials: Used in additive manufacturing R&D to assess the fatigue and creep performance of 3D-printed components under cyclic thermal loads.
4. Microelectronic Component Testing: Supports mechanical evaluation of thin films, solder joints, and packaging materials in microelectronics under temperature-controlled conditions.
5. Advanced Research in Universities and Material Labs: Ideal for academic institutions, national labs, and research centers focused on understanding mechanical response of materials in extreme environments.
6. Energy Sector Applications: Evaluates materials used in boilers, turbines, nuclear reactors, and thermal insulation, where exposure to high heat and mechanical load is frequent.